Organic Substrate Packaging Material Market, Analysis and Outlook to 2019
Transportation News and Press release service

Home > Transportation News
  • Aerospace News
  • Air Services News
  • Airlines News
  • Auto Dealership
  • Auto Manufacturers
  • Auto Parts News
  • Railroad News
  • Shipping News

    Watch Transportation News Video


  • Organic Substrate Packaging Material Market, Analysis and Outlook to 2019

     



    (Transportation-News.com, January 16, 2018 ) Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.

    Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.

    Publisher's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.

    For more information http://www.reportsweb.com/global-organic-substrate-packaging-material-market-2015-2019

    Covered in this report
    This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:
    - Packaging technology
    - Geography

    Publisher's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.

    Key regions
    - APAC
    - Europe
    - North America
    - ROW

    Key vendors
    - AJINOMOTO
    - AMKOR
    - ASE Kaohsiung
    - Mitsubishi Gas Chemical
    - SPIL
    - STATS ChipPAC

    Request Sample Copy http://www.reportsweb.com/inquiry&RW0001232171/sample

    Market driver
    - Demand for wireless devices
    - For a full, detailed list, view our report

    Market challenge
    - Dependency on semiconductor equipment industry performance
    - For a full, detailed list, view our report

    Market trend
    - Popularity of redistributed chip packaging
    - For a full, detailed list, view our report

    Make an enquiry: http://www.reportsweb.com/inquiry&RW0001232171/buying

    ReportsWeb.com

    Rajat Sahni

    +1-646-491-9876

    sales@reportsweb.com

    Source: EmailWire.Com

    Source: EmailWire.com

    Transportation Resources

    For unlimited press release distribution for $99 per month, call (281) 645-4086 or start posting your press releases online at EmailWire.com.
    Copyright 2007 GroupWeb Media LLC
    GroupWeb Media Network

    Aviation-NewsWire | ArtNewsWire | Auction NewsWire | CRM NewsWire | ePhotoNewsWire | Energy Industry | EstateNewsWire | Entertainment-NewsWire.com | Food Beverage News | Glamour NewsWire | Health NewsWire | Hosting NewsWire | i-Auto NewsWire | i-Business News | i-Homeland Security.Com | iMac-NewsWire.Com | i-Press-Release-Service | i-SoftwareNews.com | iT-NewsWire.Com
    | i-TravelNewsWire.Com | MoneyNewsWire.Net | Movie-Stars-News.Com | MSNewsWire.Net | PharmaNewsWire.Com | Publishing-NewsWire.Com | RSSNewsWire.Net | Telecom-NewsWire.Net | Transportation-News.Com | USGovernment-News.Com | WebPosters.Net | Wireless-NewsWire.Com | VoIPNewsWire.Net | XSportsWorld.Net
    EuropeNewswire.net - Newswire and Press Release service of GroupWeb Media LLC