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(Transportation-News.com, November 07, 2016 ) A SiP contains several chips such as a specialized processor, dynamic random access memory (DRAM), and flash memory. These chips are combined with passive components such as resistors and capacitors, which are placed on one substrate, requiring only a few external components to make it functional. Thus, devices packaged using this technology are ideal for space constrained environments such as smart devices. This reduces integration complexities on the printed circuit board (PCB) as well as making the overall design simpler.
Publisher's analysts forecast the global SiP market to grow at a CAGR of 10.29% during the period 2016-2020.
For more information about this report: http://www.reportsweb.com/global-system-in-package-market-2016-2020
Covered in this report
The report covers the present scenario and the growth prospects of the global SiP market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of SiP systems.
The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA
Publisher's report, Global SiP Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
- Amkor Technology
- ASE
- JCET
- SPIL
- UTAC
Request Sample Copy at http://www.reportsweb.com/inquiry&RW0001438289/sample
Other prominent vendors
- ChipMOS Technology
- ChipSiP Technology
- NANIUM
- Octavo Systems
- Samsung Electro-Mechanics
Market driver
- Need to control rising costs
- For a full, detailed list, view our report
Market challenge
- High inventory levels in supply chain
- For a full, detailed list, view our report
Market trend
- Growth of OSAT vendors
- For a full, detailed list, view our report
Inquire for Report at http://www.reportsweb.com/inquiry&RW0001438289/buying
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Priya Sisodia
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Source: EmailWire.Com 
Source: EmailWire.com
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